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DYS LC Uniboot push-pull duplex patch cord for high-density data centers

MPO/MTP Data Center Cabling

LC Uniboot

The LC Uniboot uses a single housing for a duplex connection together with a unique push-pull design and function, making it easy to assemble and use.

Full specifications, samples and bulk pricing on request — we typically reply within 24 hours.

  • 100% Pre-Shipment Tested

    Insertion & return loss (IL/RL) verified on every assembly

  • 17-Year Manufacturer

    Three in-house factories with 100+ production lines

  • Vertically Integrated

    Cable extrusion, molds and assembly under one roof

Description

The LC Uniboot uses a single housing for a duplex connection together with a unique push-pull design and function, making it easy to assemble and use. It delivers low insertion loss and back reflection with high repeatability and reliability, and is Telcordia GR-326 qualified.

Technical Specifications

Optical & Environmental Performance

Parameter Single-mode UPC Single-mode APC Multimode PC
Insertion loss ≤0.30 dB ≤0.20 dB ≤0.20 dB
Return loss ≥50 dB ≥60 dB ≥30 dB
Test wavelength 1310/1550nm 1310/1550nm 850/1310nm
Durability (500 matings) ≤0.2 dB ≤0.2 dB ≤0.2 dB
Operating temperature -40 ℃ ~ +60 ℃
Storage temperature -45 ℃ ~ +85 ℃
Fire resistant IEC 60794-2-30
Standards ROHS, IEC, GR-326

Configuration Options

Item Options
Single-mode fiber 9/125 G652D, G655, G657A/G657A2, G657B3
Multimode fiber 50/125 OM2/OM3/OM4/OM5, 62.5/125 OM1
Fiber brand YOFC, Corning, Sumitomo, Fujikura
Connector SC, LC, FC, ST, E2000, MU, MTRJ, MPO/MTP, DIN, SMA, D4 (PC/APC as applicable)
Cord type Simplex, Duplex
Cable diameter 0.9, 1.2, 1.6, 1.8, 2.0, 2.8, 3.0, 4.1 mm
Cable jacket PVC, OFNR, LSZH, OFNP
Length 0.5m, 1m, 2m, 5m, 10m, 25m, 50m, 100m … customized

Features

  • Uniboot with a single housing
  • Unique push-pull design and function
  • Easy to assemble and use
  • Low insertion loss and back reflection
  • High repeatability and reliability
  • Telcordia GR-326 qualified

Applications

  • Data centers
  • Local area networks
  • High-density applications
  • Interconnects
  • Cross-connects

INQUIRY

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